 |
Associate Professor Ankur Srivastava (ECE/ISR) and Professor Avram Bar-Cohen (Mechanical Engineering) held an evening tutorial on March 19 at the 29th Annual IEEE Thermal Measurement, Modeling and Management Symposium (SEMI-THERM29). The tutorial addressed “Microfluidic Thermal Management and Thermal-Electronic Co-Design for Chip Stacks.” The symposium was held in San Jose, CA. The focus of SEMI-THERM is to provide an annual forum for the exchange of latest technical developments in thermal management of electronic devices, components and systems. This is accomplished by providing a multifaceted program of events of interest to developers, practitioners and researchers from academia and industry. The symposium is dedicated to providing an informal atmosphere, which highlights the latest advances in the field.
Their evening tutorial focused on three-dimensional chip stacking, which is poised to become the next packaging paradigm in the electronic industry. While this paradigm provides significant improvements in device density, interconnect delays, and system integration, it can be expected to lead to higher heat densities and decreased access to chip hot spots and surfaces. Intrachip and interchip microfluidic cooling, with low boiling point, inert, dielectric liquids, is a most promising thermal management technique for this packaging paradigm, but aggressive thermal-electronic co-design is needed to achieve improved performance and energy efficiency. The tutorial presented a brief review of the emerging 3D form factors, application of microfluidic cooling, a codesign heuristic, and a Case Study exploring the benefits of co-optimization of micro-channel allocation and thermal TSV planning on chip stack performance.
The program for SEMI-THERM29 included four days of presentations, keynote addresses, workshops, and courses dedicated to thermal management and innovation that would keep today’s technology cool and operating optimally.
Related Articles:
Shi and Srivastava win 2012 ISVLSI Best Paper Award
Profile of alum Nikolaos Sidiropoulos featured in IEEE SPS newsletter
Khaligh named Editor-in-Chief of IEEE Transactions on Transportation Electrification
Khaligh Receives 2022 IEEE PELS Vehicle and Transportation Systems Achievement Award
Professor Espy-Wilson Named IEEE Fellow
Min Wu Elected President of IEEE Signal Processing Society
Alumnus David Bader Receives 2021 Sidney Fernbach Award
UMD GAMMA Group Awarded Best Paper and an Honorable Mention at IEEE VR 2021
Alumnus James Xiaojiang Du named IEEE Fellow
Rama Chellappa Wins 2020 IEEE Jack S. Kilby Signal Processing Medal
March 22, 2013
|
